TS
6723 - Senior TCB Process Engineer | $8K–$10K | Semiconductor | Admiralty | HBM & Chiplets
THE SUPREME HR ADVISORY PTE. LTD.
Position title: Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).
Должностные обязанности
- Customer Application Engineering Understand customer packaging roadmaps and manufacturing
Требования
- .
- Translate process
Требования
- into equipment specifications.
- Participate in customer technical discussions and appl…